for High Power DENSITY GPUs, IPUs, AI AND COMMUNICATION PROCESSORS |
MORE THAN 1500W
Two phases liquid cooling technology for
very high power density > 150W/cm2
Per Device Active Temperature Control within ±3°C
Hot-spots thermal management
for Multi die systems
Fast reaction to prevent thermal run away
and accurate thermal control ±3°C
In-situ test capabilities and extended data collection to enable effective
learning from fail
Adaptive stress based on real-time
calculation of DUT equivalent lifetime,
to guarantee the target mission profile for each DUT
HTOLELFRTDBI – Trials
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