TfR tester to combine stress and test in the same insertion.
Configurable by HW Kits and SW libraries to manage different IC families: low/high power SOC, Memories, MEMs, smART Power…
Management of External Test/stress Instruments (on Fixture BOST IPs) to extend test and stress capabilities for the specific IC family.
Scalable to approach engineering, Reliability and Production tests with the same platform, development and test environment
M12 (-40+150) - TTS1E (-40+175)
ELES services to optimize fixture cost, performances and reliability.
Qualified components libraries and application of consolidated Design for Manufacturing rules.
Standard and reusable mother boards with development of appliction specific IP.
Fixture Robustness optimized for extreme conditions and continuos handling.
Signal and Power Integrity simulation / optimizationservice to guarantee and optimize electrical perfomance versus test application specs.
Thermal Head design and simulation service to optimize thermal performance and cost by design phase.
HTOL - HTRB - LTOL - ELFR
ART 520 LOGICO
Universal Testing Platform.
TfR tester to combine stress and test in the same insertion.
Configurable by HW Kits and SW libraries to manage different IC families: low/high power SOC, Memories, MEMs, smART Power…
Management of External Test/stress Instruments (on Fixture BOST IPs) to extend test and stress capabilities for the specific IC family.
Scalable to approach engineering, Reliability and Production tests with the same platform, development and test environment
TIPO DI CAMERA: M12 (-40+150) - TTS1E (-40+175)
ELES services to optimize fixture cost, performances and reliability.
Qualified components libraries and application of consolidated Design for Manufacturing rules.
Standard and reusable mother boards with development of appliction specific IP.
Fixture Robustness optimized for extreme conditions and continuos handling.
Signal and Power Integrity simulation / optimizationservice to guarantee and optimize electrical perfomance versus test application specs.
Thermal Head design and simulation service to optimize thermal performance and cost by design phase.
TIPO DI PROVE: HTOL - HTRB - LTOL - ELFR
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